Ipc-7530

: Gradually increasing the temperature to avoid thermal shock to the PCB or components.

: The duration the solder remains in a liquid state. IPC-7530

A compliant thermal profile typically consists of four critical phases: : Gradually increasing the temperature to avoid thermal

: The stage where the temperature exceeds the solder's liquidus point to form the joint. IPC-7530

: Usually 20°C to 40°C above the solder's melting point.